Leverantör: Elettrorava SpA

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2021-02-01   Silicon Deep Reactive Ion Etch System and PECVD for Dielectric Materials (Chalmers tekniska högskola Aktiebolag)
This procurement is made on behalf of The Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology. This procurement aims at replacing two of our old processing equipments at Myfab Chalmers, one (1) silicon deep reactive ion etch system (Si DRIE) and one plasma enhanced chemical vapour deposition system (PECVD for dielectric materials) to further consolidate and enhance our processing capabilities. Visa upphandlingen »