Beskrivning av upphandlingen
KTH is seeking tenders for a new RIE/ICP system (equipped with load-lock and cryo-stage) dedicated to fluorine based processing. The main use of the tool will be to reactively etch dielectrics, metals, and various superconductors, as well as low pressure argon milling of inert materials.
As a new capability in the lab, the system should be able to perform high-quality anisotropic, deep silicon etching (i.e. the Bosch process). The system will mostly be used to etch small samples (possible up to 80 % of total usage), and wafers up to 4’’ diameter (remaining 20 %), but with other new purchases and our recent push towards 4’’ processing, this ratio may shift in the near future.