Combined lithography and laser ablation via hole machine
The machine will be part of a research project. The intended outcome of machine operation is complex 2D patterns which can have feature sizes of less than 1um.
The machine operation should further provide capability of laser ablation which may use external laser source.
Sista ansökningsdag
Tidsfristen för mottagande av anbud var 2011-04-18.
Upphandlingen offentliggjordes den 2011-03-09.
Vem?
Vad?
Upphandlingshistorik
| Datum |
Dokument |
| 2011-03-09
|
Meddelande om upphandling
|